Evaluation of the Oxide Thickness of Solder Bump via SERA and the Bondability of Solder Bump via Bump Fusion Test
نویسندگان
چکیده
منابع مشابه
Influence of solder bump arrangements on molded IC encapsulation
This paper presents a fluid–structure interaction (FSI) analysis of ball grid array (BGA) package encapsulation. Real-time and simultaneous FSI analysis is conducted by using finite volume code (FLUENT) and finite element code (ABAQUS), which are coupled with MpCCI. A BGA integrated circuit (IC) package with different solder bump arrangements is considered in this study. In the FSI analysis, ef...
متن کاملAn Overview of Solder Bump Shape Prediction Algorithms with Validations
The trend to reduce the size of electronic packages and develop increasingly sophisticated electronic devices with more, higher density inputs/outputs (I/Os), leads to the use of area array packages using chip scale packaging (CSP), flip chip (FC), and wafer level packaging (WLP) technologies. Greater attention has been paid to the reliability of solder joints and the assembly yield of the surf...
متن کاملthe effect of functional/notional approach on the proficiency level of efl learners and its evaluation through functional test
in fact, this study focused on the following questions: 1. is there any difference between the effect of functional/notional approach and the structural approaches to language teaching on the proficiency test of efl learners? 2. can a rather innovative language test referred to as "functional test" ge devised so so to measure the proficiency test of efl learners, and thus be as much reliable an...
15 صفحه اولconstruction and validation of the translation teacher competency test and the scale of students’ perceptions of translation teachers
the major purpose of this study was to develop the translation teacher competency test (ttct) and examine its construct and predictive validity. the present study was conducted in two phases: a qualitative phase as well as a quantitative phase. in the first phase of the study, the author attempted to find out the major areas of competency required for an academic translation teacher. the second...
new semigroup compactifications via the enveloping semigroups of associated flows
this thesis deals with the construction of some function algebras whose corresponding semigroup compactification are universal with respect to some properies of their enveloping semigroups. the special properties are of beigan a left zero, a left simple, a group, an inflation of the right zero, and an inflation of the rectangular band.
15 صفحه اولذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of The Japan Institute of Electronics Packaging
سال: 2014
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.17.189